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Hermetic Packaging Adhesion and Fracture
The main goals in this field are to develop advanced models of interface bonding, adhesion strength and adhesion fracture resistance, fracture processes of the package elements taking into account mechanical loads, thermal loads and moisture influence.
The potential possibilities of our team could allow to develop new models of chip scale packages (CSP) fracture and fracture mechanism maps for CSP, new methods for improving the package adhesion and adhesion fracture resistance by adjusting the package technology as well as for testing the adhesion fracture energy of a specimen or real package.
Knowledge of the state of the art equipment allows us create enhancements to existing as well as development of totally new schemes for testing adhesion strength and fracture characteristics at production sites. Recommendations for improving the package adhesion, package design and technology to increase the package fracture resistance could be done.
The results of developments could be used for investigation of different problems of fracture and reliability of microelectronics components with multilevel metallization under the action of mechanical loads, physical fields and active media (moisture, gas diffusion, etc.).