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Rapid Thermal Processing |
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Rapid Thermal Processing
There are four model families being created and supported per this activity:
- Model for calculations of reflectivity, transmissivity and emissivity of non-planar multilayered wafers.
- Model for calculations of temperature distribution and thermal stresses during heating of a patterned wafer in a single wafer RTP reactor.
- Model for calculations of stresses in microstructures that appear during a sequence of deposition processes.
- Model for simulation of low pressure RTCVD of silicon in a cylindrical RTCVD system
The above models could be transformed into the software tools based on customer needs for simulation and design of processes, units and equipment that involve thermal, gas dynamic and mechanical phenomena, such as RTP reactors optimization, wafer and lithography mask thermal stress analysis, remote pyrometry calibration, sensors, etc.
Capabilities
Wafer's Stress Under Heating Modeling
Wafer's Stress During Deposition Modeling